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document no. 70-0326-04 www.psemi.com page 1 of 11 ?2010-2012 peregrine semiconductor corp. all rights reserved. product description the pe42430 is a harp?-enhanced reflective sp3t rf switch developed on the ultracmos ? process technology. this tiny general purpose switch is ideal for wlan and bluetooth applications in the 2.4 - 2.5 ghz bands as well as general broadband switching applications. it is comprised of three rf ports and has low insertion loss and high isolation. an on-chip cmos decode logic facilitates a three-pin cmos control interface. unlike competitive solutions, there is no need for blocking capacitors when using the pe42430. peregrine?s harp? technology enhancements deliver high linearity and exceptional harmonics performance. it is an innovative feature of the ultracmos ? process, providing performance superior to gaas with the economy and integration of conventional cmos. product specification ultracmos ? sp3t reflective rf switch 100 ? 3000 mhz pe42430 features ?? harp?-enhanced ultracmos ? device ?? low insertion loss ?? typical 0.45 db @ 1 ghz ?? typical 0.55 db @ 2.5 ghz ?? iip3: typical +66 dbm ?? p0.1db compression: typical +30 dbm ?? excellent esd tolerance of 4500v hbm and 250v mm on all ports ?? no external v dd required. v dd is derived from switch control inputs ?? package type: 8-lead 1.5 x 1.5 mm dfn figure 1. functional diagram figure 2. package type 8-lead 1.5 x 1.5 mm dfn rf1 cmos control/driver and esd v1 v2 esd esd esd rf3 rfc rf2 esd v3
product specification pe42430 page 2 of 11 ?2010-2012 peregrine semiconductor corp. all rights reserved. document no. 70-0326-04 ultracmos ? rfic solutions table 1. electrical specifications 1 : nominal @ 25c, v1, v2 or v3 = 3v/5v (z s = z l = 50 ? ) notes: 1. specifications under min and max nominal conditions 2. please refer to maximum input power (50 ? ) in table 4 3. switching time is measured while the part is powered on and one of the control pins is switching state 4. turn on time is defined as the time it takes the par t to go from an unpowered state to 90% rf voltage. max power can only be applied after the part is turned on 5. video feedthrough is measured by terminating all ports and measuring peak transients while switching logic state electrical parameter path condition min typ max unit operating frequency 100 3000 mhz insertion loss rfc-rfx 100 to 1000 mhz 0.45 0.56 db 1000 to 3000 mhz 0.65 0.9 db 2400 to 2500 mhz 0.55 0.8 db isolation rfx-rfx 100 to 1000 mhz 35 40 db 1000 to 3000 mhz 23 28 db 2400 to 2500 mhz 25 30 db isolation 100 to 1000 mhz 34 40 db 1000 to 3000 mhz 23 28 db 2400 to 2500 mhz 25 30 db return loss (active port) rfx 100 to 1000 mhz 22 db 1000 to 3000 mhz 16 db 2400 to 2500 mhz 18 db return loss (common port) rfc 100 to 1000 mhz 22 db 1000 to 3000 mhz 16 db 2400 to 2500 mhz 18 db input 0.1 db compression 2 rfc-rfx 100 to 3000 mhz 30 dbm iip3 rfc-rfx 100 to 3000 mhz 66 dbm iip2 rfc-rfx 100 to 3000 mhz 100 dbm switching time 3 50% ctrl to 90% or 10% of final value 500 ns video feedthrough 5 10 mv rfc-rfx turn on time 4 50% ctrl to 90% or 10% of rf 1.5 2.0 s
product specification pe42430 page 3 of 11 document no. 70-0326-04 www.psemi.com ?2010-2012 peregrine semiconductor corp. all rights reserved. table 3. electrical specifications: min/max performance @ -40 to +85c, v1, v2 or v3 = 3.0v to 5.5v (z s = z l = 50 ? ) electrical parameter path condition min typ max unit operating frequency 100 3000 mhz insertion loss rfc-rfx 100 to 1000 mhz 0.45 0.65 db 1000 to 3000 mhz 0.65 0.95 db 2400 to 2500 mhz 0.55 0.85 db isolation rfx-rfx 100 to 1000 mhz 35 40 db 1000 to 3000 mhz 23 28 db 2400 to 2500 mhz 25 30 db isolation rfc-rfx 100 to 1000 mhz 34 40 db 1000 to 3000 mhz 23 28 db 2400 to 2500 mhz 25 30 db
product specification pe42430 page 4 of 11 ?2010-2012 peregrine semiconductor corp. all rights reserved. document no. 70-0326-04 ultracmos ? rfic solutions pin # pin name description 1 rfc 1 rf common 2 n/c no connect 3 v1 switch control input, cmos logic level 4 rf1 1 rf i/o 5 rf2 1 rf i/o 6 v2 switch control input, cmos logic level 7 v3 switch control input, cmos logic level 8 rf3 1 rf i/o paddle gnd exposed ground paddle. ground for proper device operation table 3. pin descriptions table 5. absolute maximum ratings exceeding absolute maximum ratings may cause permanent damage. operation should be restricted to the limits in the operating ranges table. symbol parameter/conditions min max units t st storage temperature range -55 +150 c p in maximum input power (50 ? ) 30 dbm v esd esd voltage hbm 1 all pins 4500 v v esd esd voltage mm 2 , all pins 250 v notes: 1. hbm esd voltage (mil_std 883 method 3015.7) 2. mm esd voltage (mm, jedec jesd22-a115-a ) figure 3. pin configuration (top view) note 1: rf pins 1, 4, 5 and 8 must be at 0 vdc. the rf pins do not require dc blocking capacitors for proper oper ation if the 0 vdc requirement is met 9 dgnd rf2 v2 v3 rf3 rfc n/c v1 rf1 5 6 7 8 1 2 3 4 exposed ground paddle pin 1 indicator table 4. operating ranges parameter symbol min typ max units i dd power supply current i dd 130 230 a v ctrl control voltage high v ih 3 5.5 v v ctrl control voltage low v il 0 0.6 v operating temperature range t op -40 +85 c maximum input power (50 ? ) cw @ +85c cw @ +25c p in +27 +30 dbm dbm
product specification pe42430 page 5 of 11 document no. 70-0326-04 www.psemi.com ?2010-2012 peregrine semiconductor corp. all rights reserved. latch-up avoidance unlike conventional cmos devices, ultracmos ? devices are immune to latch-up. table 6. truth table moisture sensitivity level the moisture sensitivity level rating for the pe42430 in the 8-lead 1.5 x 1.5 mm dfn package is msl1. switching frequency the pe42430 has a maximum 25 khz switching rate. path v1 v2 rfc - rf1 1 0 rfc - rf2 0 1 rfc - rf3 0 0 v3 0 0 1 note: any state other than shown in table 6 are undefined states electrostatic discharge (esd) precautions when handling this ultracmos ? device, observe the same precautions that you would use with other esd-sensitive devices. although this device contains circuitry to protect it from damage due to esd, precautions should be taken to avoid exceeding the specified rating.
product specification pe42430 page 6 of 11 ?2010-2012 peregrine semiconductor corp. all rights reserved. document no. 70-0326-04 ultracmos ? rfic solutions figure 4. insertion loss vs temperature (rfx-rfc) figure 5. insertion loss vs v dd (rfx-rfc) figure 6. insertion loss rfx
product specification pe42430 page 7 of 11 document no. 70-0326-04 www.psemi.com ?2010-2012 peregrine semiconductor corp. all rights reserved. figure 7. rfx-rfx isolation vs temperature figure 8. rfx-rfx isolation vs v dd figure 9. rfc-rfx isolation vs temperature figure 10. rfc-rfx isolation vs v dd
product specification pe42430 page 8 of 11 ?2010-2012 peregrine semiconductor corp. all rights reserved. document no. 70-0326-04 ultracmos ? rfic solutions figure 13. active port return loss vs temperature (rfx) figure 14. active port return loss vs v dd (rfx) figure 11. rfc port return loss vs temperature figure 12. rfc port return loss vs v dd
product specification pe42430 page 9 of 11 document no. 70-0326-04 www.psemi.com ?2010-2012 peregrine semiconductor corp. all rights reserved. evaluation kit information the sp3t switch evaluation kit facilitates custom- er evaluation of the pe42430 sp3t switch. the rf common port is connected through a 50 ? transmission line to j2. ports 1, 2 and 3 are con- nected through 50 ? transmission lines to j3, j5 and j4 respectively. j1 provides digital inputs v1, v2 and v3 to the device. on the back of the board, a through line connects sma connectors j6 and j7. this transmission line can be used to estimate the pcb loss over the environmental conditions. this four layer board is composed of rogers 4350 on the top and bottom and fr4 on the inner layers with a total thickness of 0.062?. all transmission lines have 21.5 mil width and 7.25 mil gap. use jumpers on header j1 to short the control pins to ground for logic low. v dd is supplied to the part through at least one of the control pins via pins 1, 3 or 5 (v3, v2, v1) on header j1. figure 16. evaluation kit schematics figure 15. evaluation board layouts 101-0604
product specification pe42430 page 10 of 11 ?2010-2012 peregrine semiconductor corp. all rights reserved. document no. 70-0326-04 ultracmos ? rfic solutions figure 17. mechanical specifications symbol common dimensions (mm) dimensions (in) min nom max min nom max a 0.45 0.50 0.55 0.018 0.020 0.022 a3 0.127 ref 0.005 ref a1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 d 1.45 1.50 1.55 0.058 0.060 0.062 d2 1.15 1.20 1.25 0.046 0.048 0.050 e 1.45 1.50 1.55 0.058 0.060 0.062 e2 0.65 0.70 0.75 0.026 0.028 0.030 e 0.40 bsc l 0.125 0.175 0.225 0.005 0.007 0.009 k 0.200 - - 0.008 - - 0.016 bsc figure 18. marking specifications pzz yww marking ? spec ? symbol ? package marking definition p a-z part# code zz 00-99 last two digits of lot code y 0-9 last digit of year, star ? ng from 2011 (1 for 2011,2 for 2012 etc) ww 01-53 work week 17-0154
product specification pe42430 page 11 of 11 document no. 70-0326-04 www.psemi.com ?2010-2012 peregrine semiconductor corp. all rights reserved. figure 19. tape and reel drawing drawing not drawn to scale pocket hole diameter 0.6 0.05 mm bumped die are oriented active side down maximum cavity angle 5 o advance information : the product is in a formative or design stage. the datasheet contains design target specifications for product development. specifications and features may change in any manner without notice. preliminary specification: the datasheet contains preliminary data. additional data may be added at a later date. peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product. product specification: the datasheet contains final data. in the event peregrine decides to change the specifications, peregrine will notify custom ers of the intended changes by issuing a cnf (customer notification form). the information in this datasheet is believed to be reliable. however, peregrine assumes no liability for the use of this information. use shall be entirely at the user?s own risk. no patent rights or licenses to any circuits described in this datasheet are implied or granted to any third party. peregrine?s products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the peregrine product could create a situation in which personal injury or death might occur. peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. the peregrine name, logo, ultracmos and utsi are registered trademarks and harp, multiswitch and dune are trademarks of peregrine semiconductor corp. sales contact and information for sales and contact information please visit www.psemi.com . table 7. ordering information order code description package shipping method PE42430MLAA-Z pe42430 sp3t rf switch green 8ld 1.5x1.5 dfn 3000 units t/r ek42430-01 pe42430 evaluation board evaluation kit 1/box

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